The C&C Division is the leader in the semiconductor precision parts cleaning and coating industry due to its customer-centric quality management. We deliver semiconductor equipment parts that have been ultra-precisely cleaned and coated using state-of-the-art technology, based on solid trust in our customers' products and reliable systems. With ultra-precise cleaning utilizing various techniques based on the kind and shape of the process reaction products and coatings that generate highly functional films of rare earth oxide materials, we increase the life of products and realize the conditions of the semiconductor manufacturing process.
Gumi Plant
Anseong Plant
Xi'an Plant
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| Division | APS | |||
|---|---|---|---|---|
| Y2O3 | Nano | SB | E-APS | |
| Characteristic | Outstanding plasma resistance | Increased collection capacity of the reaction product ↑ Outstanding chemical resistance |
Stabilized back-up time | Outstanding chemical/physical resistance |
| Pore Density | 3%↓ | 3%↓ | 2%↓ | 1%↓ |
| Hardness (Ratio) | 1 (B.M) | 2.2 | 0.8 | 1.9 |
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| Division | SPS | PVD | |
|---|---|---|---|
| Y₂O₃ | I-SD | I-SD H | |
| Characteristic | Outstanding durability of high-power plasma |
An upper part of chamber Outstanding chemical/physical resistance |
An upper part of a high-integration etching process Outstanding chemical/physical resistance |
| Pore Density | 0.5%↓ | Near Zero | |
| Hardness (Ratio) | 2.0 | 2.7 | 3.6 |
| Micro-structure |
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