Ceramic|WONIK QnC

A global partner for functional ceramic parts and
structural ceramic parts for semiconductor equipment

The Ceramic Division manufactures a variety of materials (Al2O3, Y2O3, YAG, SiC, AlN, Si3N4, ZrO2, BN) and internalizes all functional ceramic part manufacturing processes (ESC, Heater, Wafer Table). The Ceramic Division offers integrated precision ceramic part solutions for the semiconductor, OLED, and automotive industries.

Features

Best quality in terms of client satisfaction
- ISO 9001, 14001, 27000, 45001
- Owning a large 3D measurement device (4000x1600) with a 300mm Zygo interferometer
System for batch manufacturing of ceramic parts
- Owning all raw ingredients, materials, and processing facilities and procedures for ceramic manufacturing
Manufacturing of functional parts
- ESC, AlN Heater, pBN High-temperature ESC, Pulse Heater, Wafer Table
- Customer-specific products (design simulation, production, test)

Electrostatic Chuck (ESC)

High-quality ceramic materials are manufactured by hot press sintering
Technology for ESC repair
Ultra-precise surface shape control technology

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정전척(ESC)
Item		Unit	AW100H	AS250H
Color		-	Right gray	Black
Relative density		%	≥ 99.7	≥ 99.0
Dielectric constant (1MHz)		F/m	10.5	11
Dielectric loss (1MHz)		-	2 X 10^-3	2 X 10^-3
Volume resistivity	RT	Ω•cm	2 X 10¹⁶	1 X 10¹⁶
Bending strength		MPa	≥ 500	≥ 500
Vickers hardness		HV	≥ 1800	≥ 2100

Thermocompression bonding heater

Design and production of heating wires enabling rapid heating and fast cooling
Composition control allows for the production of AlN ceramic sintered bodies with high density and high thermal conductivity.
High flatness and parallelism can be achieved using ultra-precision processing techniques.

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Thermocompression bonding heater
Properties	Single-Zone	Multi-Zone
Use Temperature (℃)	>400℃	>400℃
Heating Rate (℃/sec)	200	40
Cooling Rate (℃/sec)	100	10
Thermal Conductivity (W/m·K)	200	200
Uniformity (@400℃)	<3℃	<10℃
Size (mm)	12, 16, 22	50, 60, 70, 120

AlN heater

Multi-zone design and production with consistent temperature density
Sintering of high-density and high-quality AlN composite ceramics
Volume resistive materials are realized for each process, including high-temperature processes above 650 °C.
Suppression of heat wire resistance for homogeneous temperature range
Leakage current reduction between RF-heaters for high-power plasma application

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AlN heater
Properties		A450	A550	A650
Density (g/㎤)	RT	3.3	3.3	3.3
Volume Resistivity (Ω∙㎝)	RT	E+14	E+15	E+15
Thermal conductivity (W/m∙k)	RT	170	95	70
Coefficient of thermal expansion ( x 10-6/K)	RT-800 ℃	5.4	5.3	5.3